Metallization Development of Multi-Walled Carbon Nanotubes (MWCNTs) with Copper by an Electroless Plating

Dewa Pancarana, I Budiartana

2021

Abstract

In this study, Multi Walled Carbon Nanotubes (MWCNTs) were coated with copper by an electroless plating process. The aim is to form a strong bond between the MWCNTs and the Aluminum matrix. Aluminum in liquid form has a high surface tension compared to the surface tension of MWCNTs, resulting in very poor wettability. The surface of MWCNTs coated with metal (copper) will increase the dispersion and wettability between MWCNTs and the Aluminum matrix. The research was conducted at the mechanical engineering laboratory, Bali State Polytechnic. Coating MWCNTs with copper is carried out in three steps, namely: activation, acceleration, and electroless. MWCNTs were activated using a Pd-Sn colloidal solution adapted from the Plating on Plastics (POP) industry. The ingredients used in the activation process were a mixture of 37.5 ml of Pd-Sn colloid solution, 37.5 ml of HCl (37%), and 175 ml of DI water. In the acceleration process, fluoride acid (HF 55%) is used as an accelerator. The last process is the electroless plating process, in which the surface of the MWCNTs that has been catalyzed is inserted into the Copper-Cobalt (Cu-Co) electrolyte solution. Copper-coated MWCNTs were characterized using scanning electron microscopy (SEM-EDX) analysis using (JEOL-JSM 6510 A) at the Mechanical Engineering Materials Laboratory, Udayana University. The results of the SEM-EDX test showed that the copper content was 84.1%, carbon 12.08%, and the rest were other elements, such as: O, Na, K, Co, Pd, Sn. The increasing size of MWCNTs indicates the presence of copper on the surface of MWCNTs. The average diameter of the 85 nm copper-clad MWCNTs increased compared to the average diameter of the initial MWCNTs (10–20 nm).

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Paper Citation


in Harvard Style

Pancarana D. and Budiartana I. (2021). Metallization Development of Multi-Walled Carbon Nanotubes (MWCNTs) with Copper by an Electroless Plating. In Proceedings of the 4th International Conference on Applied Science and Technology on Engineering Science - Volume 1: iCAST-ES, ISBN 978-989-758-615-6, pages 1086-1090. DOI: 10.5220/0010959500003260


in Bibtex Style

@conference{icast-es21,
author={Dewa Pancarana and I Budiartana},
title={Metallization Development of Multi-Walled Carbon Nanotubes (MWCNTs) with Copper by an Electroless Plating},
booktitle={Proceedings of the 4th International Conference on Applied Science and Technology on Engineering Science - Volume 1: iCAST-ES,},
year={2021},
pages={1086-1090},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0010959500003260},
isbn={978-989-758-615-6},
}


in EndNote Style

TY - CONF

JO - Proceedings of the 4th International Conference on Applied Science and Technology on Engineering Science - Volume 1: iCAST-ES,
TI - Metallization Development of Multi-Walled Carbon Nanotubes (MWCNTs) with Copper by an Electroless Plating
SN - 978-989-758-615-6
AU - Pancarana D.
AU - Budiartana I.
PY - 2021
SP - 1086
EP - 1090
DO - 10.5220/0010959500003260