3 CONCLUSION
This article focuses on the structure, principle and
application of piezoelectric pressure sensors,
capacitive pressure sensors and piezoresistive
pressure sensors. With the development and progress
of technology, flexible mechanisms and pressure
sensors are gradually integrated. Flexible pressure
sensors have the characteristics of high sensitivity,
long service life, and can be applied to more
diversified environments. Therefore, the
development of flexible pressure sensors has become
the main trend of future sensor development.
There are several challenges in the way of the
advancement of flexible sensors. The flexible
structure of the flexible pressure sensor and the
selected material often affect the final performance of
the pressure sensor. Different application fields have
different requirements for sensor accuracy and
different application environments. Therefore, the
application field needs to be considered when
designing flexible mechanisms and finding new
functional materials. In addition, the production and
processing of sensors also need to keep up with the
speed of technological development. Finding new
sensing mechanisms is essential for future sensor
development. The article suggests that in the future
development of pressure sensors, attention should be
paid to finding new pressure sensor sensing
mechanisms. This can not only broaden the
application range of sensors, but also provide options
for applications that require higher accuracy, simpler
preparation and lower cost. The advancement of
pressure sensors should be associated with
applications. Further research based on application
requirements is a prerequisite for the advancement of
pressure sensors.
REFERENCES
Cao, M., Su, J., Fan, S., Qiu, H., Su, D., & Li, L. (2021).
Wearable piezoresistive pressure sensors based on 3D
graphene. Chemical Engineering Journal, 406, 126777.
Chiang, C. C., Lin, C. C. K., & Ju, M. S. (2007). An
implantable capacitive pressure sensor for biomedical
applications. Sensors and Actuators A: Physical, 134(2),
382-388.
Duan, Y., He, S., Wu, J., Su, B., & Wang, Y. (2022). Recent
progress in flexible pressure sensor arrays.
Nanomaterials, 12(14), 2495.
Gautschi, G. (2002). Piezoelectric sensors (pp. 73-91).
Springer Berlin Heidelberg.
Liu, E., Cai, Z., Ye, Y., Zhou, M., Liao, H., & Yi, Y. (2023).
An overview of flexible sensors: Development,
application, and challenges. Sensors, 23(2), 817.
Ma, R. (2024). Research on flexible piezoelectric pressure
sensor based on hybrid MAPbI3 pressure-sensitive
material, Xidian University.
Meti, S., Balavald, K. B., & Sheeparmatti, B. G. (2016).
MEMS piezoresistive pressure sensor: A survey.
International Journal of Engineering Research and
Applications, 6(4), 23-31.
Mishra, R. B., El-Atab, N., Hussain, A. M., & Hussain, M.
M. (2021). Recent progress on flexible capacitive
pressure sensors: From design and materials to
applications. Advanced Materials Technologies, 6(4),
2001023.
Szczerba, Z., Szczerba, P., & Szczerba, K. (2022).
Sensitivity of piezoresistive pressure sensors to
acceleration. Energies, 15(2), 493.
Tian, H., Lin, Q., & Li, B. (2006). Research on the
application of optical fiber transmission technology of
piezoelectric pressure sensor. Sensors and
Microsystems, 25(2), 3.
Tran, A. V., Zhang, X., & Zhu, B. (2018). Mechanical
structural design of a piezoresistive pressure sensor for
low-pressure measurement: A computational analysis
by increases in the sensor sensitivity. Sensors, 18(7),
2023.
Wang, L., Qin, L., & Li, L. (2010). Piezoelectric dynamic
pressure sensor. 2010 IEEE International Conference
on Information and Automation (pp. 906-911). IEEE.
Yuan, H., Zhang, Q., Zhou, T., Wu, W., Li, H., Yin, Z., ...
& Jiao, T. (2024). Progress and challenges in flexible
capacitive pressure sensors: Microstructure designs and
applications. Chemical Engineering Journal, 149926.
Zhang, J., Chen, J., Li, M., Ge, Y., Wang, T., Shan, P., &
Mao, X. (2018). Design, fabrication, and
implementation of an array-type MEMS piezoresistive
intelligent pressure sensor system. Micromachines, 9(3),
104.