Advancements in Electrode Materials for Brain-Computer Interface Technology

Shuyue Xue

2025

Abstract

BCI technology become highly focus with the delevopment of neuroscience. It uses biology signal in brain to cure diseases. Despite of the input scale, the electrode material has been divided into non-invasive electrodes, semi-invasive electrodes and invasive electrodes. Non-invasive electrodes is safe but weak in spatio-temporal resolution; Semi-invasive electrodes are implant by injection using special rheoligical preperties; Invasive electrodes can ensure the strength and the quality of EEG signals but the surgery is risky. People still find it hard to deal with the biocompability problems. This paper talking about three kinds of electrodes, their features, the materials they’re using and the reason. Due to these information BCI materials is widely use in the field of medical and aerospace. They start the discussion on optimizing material formulations and manufacturing processes, improving material multifunctionality, solving material degradation and infection problems, and developing materials integrated with energy harvesting and storage functions. This paper aims to give a general and specific view of the materials BCI electrodes are using, and inspire people to dig out other complex and useful materials in the future.

Paper Citation

in Harvard Style

Xue S. (2025). Advancements in Electrode Materials for Brain-Computer Interface Technology. In Proceedings of the 1st International Conference on Biomedical Engineering and Food Science - Volume 1: BEFS; ISBN 978-989-758-789-4, SciTePress, pages 53-57. DOI: 10.5220/0014399100004933

in Bibtex Style

@conference{befs25,
author={Shuyue Xue},
title={Advancements in Electrode Materials for Brain-Computer Interface Technology},
booktitle={Proceedings of the 1st International Conference on Biomedical Engineering and Food Science - Volume 1: BEFS},
year={2025},
pages={53-57},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0014399100004933},
isbn={978-989-758-789-4},
}

in EndNote Style

TY - CONF

JO - Proceedings of the 1st International Conference on Biomedical Engineering and Food Science - Volume 1: BEFS
TI - Advancements in Electrode Materials for Brain-Computer Interface Technology
SN - 978-989-758-789-4
AU - Xue S.
PY - 2025
SP - 53
EP - 57
DO - 10.5220/0014399100004933
PB - SciTePress