The Investigation of Industry Application Scenarios in Digital Signature

Yuchen Liu

2024

Abstract

The rapid development of the digital era has brought about significant changes in how corporations operate, presenting numerous opportunities along with the challenge of maintaining security and trust in the digital realm. Digital signatures have emerged as a crucial aspect of verifying the authenticity of digital files and providing legally binding signatures. This paper explores the development, applications, and challenges associated with digital signatures in various industries such as digital finance, medical, legal, and government agencies. The discussion includes the use of encryption algorithms and hash functions to ensure secure, verifiable, and tamper-proof signatures. Additionally, the potential of emerging technologies like blockchain, artificial intelligence, and the Internet of Things in shaping the future of digital signatures is delved into. Compliance with laws and regulations and the need for robust private key management systems are identified as key challenges. The integration of blockchain technology is proposed to enhance the security and trust of digital signatures, while artificial intelligence can improve verification processes. Looking ahead, a promising future for digital signatures with increased adoption, global interoperability, and continued advancements in technology and legal frameworks is anticipated.

Paper Citation

in Harvard Style

Liu Y. (2024). The Investigation of Industry Application Scenarios in Digital Signature. In Proceedings of the 1st International Conference on Data Science and Engineering - Volume 1: ICDSE; ISBN 978-989-758-690-3, SciTePress, pages 542-546. DOI: 10.5220/0012837200004547

in Bibtex Style

@conference{icdse24,
author={Yuchen Liu},
title={The Investigation of Industry Application Scenarios in Digital Signature},
booktitle={Proceedings of the 1st International Conference on Data Science and Engineering - Volume 1: ICDSE},
year={2024},
pages={542-546},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0012837200004547},
isbn={978-989-758-690-3},
}

in EndNote Style

TY - CONF

JO - Proceedings of the 1st International Conference on Data Science and Engineering - Volume 1: ICDSE
TI - The Investigation of Industry Application Scenarios in Digital Signature
SN - 978-989-758-690-3
AU - Liu Y.
PY - 2024
SP - 542
EP - 546
DO - 10.5220/0012837200004547
PB - SciTePress