Reduced Order Modeling for Thermal Problems with Temperature-dependent Conductivities using Matrix Interpolation

Meinhard Paffrath

2021

Abstract

In this paper model order reduction of thermal problems with temperature dependent material parameters is considered. It is assumed that the full thermal problem is set up by a commercial solver where the user has only limited access to internal datastructures. For the full problem an approximation based on matrix interpolation is proposed which is applicable to commercial solvers like Simcenter Thermal Flow where system matrices can be extracted for given temperature fields. Model order reduction for the approximated problem is achieved by POD and DEIM.

Paper Citation

in Harvard Style

Paffrath M. (2021). Reduced Order Modeling for Thermal Problems with Temperature-dependent Conductivities using Matrix Interpolation. In Proceedings of the 11th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH, ISBN 978-989-758-528-9, pages 15-20. DOI: 10.5220/0010507900150020

in Bibtex Style

@conference{simultech21,
author={Meinhard Paffrath},
title={Reduced Order Modeling for Thermal Problems with Temperature-dependent Conductivities using Matrix Interpolation},
booktitle={Proceedings of the 11th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH,},
year={2021},
pages={15-20},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0010507900150020},
isbn={978-989-758-528-9},
}

in EndNote Style

TY - CONF

JO - Proceedings of the 11th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH,
TI - Reduced Order Modeling for Thermal Problems with Temperature-dependent Conductivities using Matrix Interpolation
SN - 978-989-758-528-9
AU - Paffrath M.
PY - 2021
SP - 15
EP - 20
DO - 10.5220/0010507900150020