Vertical Optical Waveguide Comprising Square Base Cuboid Cores with Size Modulation for Multilayer Chip-to-Chip Interconnection

Songpin Ran, Takaaki Kakitsuka, Kiyoto Takahata

2020

Abstract

For chip-to-chip interconnection, a Pbit/s-class transmission capacity is expected to be developed in near future. To achieve such a huge capacity, a multilayer optical waveguide structure for connection between chips is indispensable. In this paper, a square base cuboid-core structure with size modulation for vertical light beam propagation in a polymer multilayer waveguide is proposed for improving optical coupling between the optical devices and waveguide. A 10-layer polymer waveguide with nonuniform cuboid cores are designed for single-mode transmission at 1.31 μm. Using a simulation based on the beam propagation method, it is confirmed that the proposed design can provide a coupling efficiency of −4.4 dB, which is 3.8 dB higher than that of a previously reported uniform cube-core design, for the 10-layer structure and a crosstalk of −20.6 dB. The simulated results show that the proposed nonuniform cuboid-core structure has the potential to realize a 10-layer optical waveguide structure for future chip-to-chip optical interconnection with a huge transmission capacity.

Paper Citation

in Harvard Style

Ran S., Kakitsuka T. and Takahata K. (2020). Vertical Optical Waveguide Comprising Square Base Cuboid Cores with Size Modulation for Multilayer Chip-to-Chip Interconnection. In Proceedings of the 8th International Conference on Photonics, Optics and Laser Technology - Volume 1: PHOTOPTICS, ISBN 978-989-758-401-5, pages 174-179. DOI: 10.5220/0009173401740179

in Bibtex Style

@conference{photoptics20,
author={Songpin Ran and Takaaki Kakitsuka and Kiyoto Takahata},
title={Vertical Optical Waveguide Comprising Square Base Cuboid Cores with Size Modulation for Multilayer Chip-to-Chip Interconnection},
booktitle={Proceedings of the 8th International Conference on Photonics, Optics and Laser Technology - Volume 1: PHOTOPTICS,},
year={2020},
pages={174-179},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0009173401740179},
isbn={978-989-758-401-5},
}

in EndNote Style

TY - CONF

JO - Proceedings of the 8th International Conference on Photonics, Optics and Laser Technology - Volume 1: PHOTOPTICS,
TI - Vertical Optical Waveguide Comprising Square Base Cuboid Cores with Size Modulation for Multilayer Chip-to-Chip Interconnection
SN - 978-989-758-401-5
AU - Ran S.
AU - Kakitsuka T.
AU - Takahata K.
PY - 2020
SP - 174
EP - 179
DO - 10.5220/0009173401740179