also called pitch- of 2 µm and a vertical periodicity 
about 2.5 µm. This vertical periodicity is limited to 
the lattice parameter: when approaching to the pitch 
value, the vertical periodicity is more difficult to 
achieve and the profile is much more difficult to 
control by EE. Although some other studies reported 
modulated structures in 700 nm (Langner 2008), 
they did not insert a cavity in their structures, 
probably because the profiles were not as good as 
the ones obtained in 2 µm of pitch. In the present 
study, the samples used to fabricate the macroporous 
silicon PCs had a pitch of 700 nm and a vertical 
periodicity around the lattice parameter, what 
enabled us to place a peak and tailor it at wavelength 
as short as 4.6 microns, were different gas 
absorption peaks can be found. 
By removing around 160 µm of bulk silicon of the 
samples, we have been able to increase the 
transmission percentage from values around 4%-6% 
up to values between 25% and 30%. This improves 
the features of the peak –i.e. transmittance and 
quality factor- and, as a consequence, the sensitivity 
of the final gas sensor device is enhanced. Further 
improvement of the transmission could be achieved 
by removing some more bulk silicon, but the risk of 
damaging the photonic crystal –mechanical support 
or etching of the PC structure- becomes high and 
some silicon bulk has to be left to avoid these 
problems. In the case of thermal emission this layer 
has not an important impact in the relative 
transmission amplitude of the peak –from the base to 
the top of the resonant peak-, but it has a 
considerable effect in the position of the base point. 
Specifically, the more bulk silicon the more 
radiation of the no texturized region, which is finally 
reflected in a higher offset from the zero emission 
point to the base point, where the emission peak 
rises. 
The conclusions drawn in this paper lead us to 
confirm that the studied macroporous silicon 
structures can be employed in gas sensing 
applications. However, further work has to be done 
in order to improve the amplitude and the Q-factor 
of the peak, as well as to reduce the offset, either 
working in transmission or emission. 
2 EXPERIMENTAL 
The 3D structures were obtained by electrochemical 
etching of n-type (100) crystalline silicon samples in 
hydrofluoric (HF) acid solution. The starting 
material had a resistivity between 0.1-0.3 Ω·cm 
(~3·10
16
/cm
3
 phosporous-doped). An N
+
  layer was 
implanted on the backside of the wafer to provide a 
low-resistance transparent ohmic contact. Next, the 
wafer was oxidized and a nanoimprint lithography of 
700 nm pitch was performed. A Reactive-ion 
Etching (RIE) and a tetramethylammonium 
hydroxide (TMAH) etching were done to create 
inverted pyramid-shaped pits that act as nucleation 
centres for the ordered pore growth. Finally, the EE 
etching was carried out to control the modulation of 
pore diameter which, is regulated by the applied 
etching current. This method allows to design the 
profile beforehand and to create smooth 3D 
structures of great complexity just by applying 
different etching currents.  
In particular, the periodical profiles attached in 
Fig.1 have been generated. In the first sample (left) 
the depth periodicity was set to be about 1.1-1.2 µm 
what arouse a bandgap around [5-7] µm. As 
depicted in the figure, a planar defect was introduced 
halfway the total pore depth by suppressing one of 
the modulations and leaving a constant diameter 
section. The length of the cavity varied from 2.1 µm 
to 2.6 µm with a diameter of 0.23 µm in all the 
samples. In order to reduce the bandgap central 
wavelength, and thus the position of the peak, the 
vertical modulation of the pore was shortened. In 
concrete, it was set to the lattice constant value 
(~700nm). Thanks to that, the bandgap moved to the 
range of [4-5] µm, while the defect’s length took 
values in the range of [1.5-1.8] µm. The total depth 
of all samples was about 12-15 micrometers. A 
complete description of the process can be found 
elsewhere (Lehmann 1993). The second fabricated 
structure can be observed in the right image. 
 
Figure 1: Cross sectional view of two 3-D PCs fabricated 
by EE over a litography of 0.7 μm pitch. The inclusion of 
a defect in the PC lattice enables a transmitted mode in 6.4 
µm (left) and 4.6 µm (right). (les he reordenat en l’ordre 
del text).