
The diaphragm on the PDMS structure is fabricated 
using a SU-8 mold (height of 50 µm). The PDMS 
pre-polymer is mixed in the ratio of 10:1 
(base/curing agent) and subsequent degassed in a 
vacuum desiccator in order to prevent bubble 
formation in the mold material (due to incorporated 
gas and crosslinking reaction by-products).  
The PDMS is then deposited by spin coating 
over the mold at 500 rpm in order to obtain a PDMS 
50 µm thick film. After this step, it is cured in a hot 
plate at a temperature of 85°C for a period of two 
hours. Subsequently the PDMS structure that 
contains the diaphragm is detached from the mold, 
with the help of a scalpel, that cuts the area around 
the patterned zone and it is placed over a glass slide. 
Then, a metallic thin film is deposited onto the 
PDMS to create the strain gauges. This film is 
deposited by Physical Vapor Deposition (E-beam) 
and patterned by standard photolithography. In this 
process the positive photoresist AZ4562 is deposited 
by spin coating at 6000 rpm for 20 seconds and 
cured in a hot plate at 100°C for 10 minutes. After 
this period the samples are left to cool for 10 
minutes and, then, exposed to UV light with the 
MaskAligner equipment. In order to accomplish this 
process it is necessary to use the mask that contains 
the micro features to be transferred and exposed 
using the Soft Contact mode during 0.85 minutes. 
Then, the photoresist developer is used to remove 
the zones exposed to the UV light remaining only 
over the metallic zones that were protected. This 
removing process uses a solution that contains the 
AZ351-B developer diluted in distilled water (4:1) 
and a mixer to perform the photoresist development. 
After 10 minutes developing it is cleaned with 
distilled water and dried with a nitrogen flow.  
With the previous steps successfully carried out, 
it is necessary to perform the etch of the metallic 
deposited films. For the aluminium etching a 
recipient that contains an Al etch solution is used. 
Next, it is visualized when all the non-protected 
areas have been removed. The samples are then 
removed, cleaned with IPA and dried with a nitrogen 
flow. Other etchants can be used for other metals. In 
the case of Gold, a Gold etch TFA can be used. To 
finish the patterning of the metallic film it is 
necessary to remove the photoresist that has been 
used to protect the zones of interest. For that, a 
solution of AZ100 is used during 15 minutes. The 
structure is then cleaned with distilled water. An 
example of the final structure obtained is presented 
in Figure 8. In order to maintain the electric contact 
from the strain gauges to the exterior, wires are then 
attached to the conductive pads with silver 
conductive paint. Finally, the external PDMS layer 
(30 µm) is spun (800 rpm) onto the metal to cover 
the sensors. Although the manufacturing process just 
described has been successfully used, several 
challenges must be overcome. First, it is necessary 
to improve the adhesion between the metal film and 
the surface of PDMS, which could be done with 
chromium adhesion layers or plasma surface 
treatment of PDMS prior to deposition. 
Another problem is the presence of microcracks 
that can appear due to the pressure and temperature 
conditions involved in the deposition process. As 
such, an optimization of the process or the metal of 
choice is currently being carried out. The best results 
at this stage were obtained for aluminium and gold. 
 
Figure 7: Schematic representation of the fabrication 
process of the strain gauges. a) SU-8 mold; b) pouring the 
PDMS pre-polymer on the SU-8 mold and curing; c) 
detaching the structure in PDMS and putting on a glass 
slide; d) deposition and patterning the metallic film; e) 
outer electrical contacts; f) covering the sensors with a 
second layer of PDMS; g) separating the sensor. 
 
Figure 8: Aluminium strain gauges embedded in PDMS. 
4  READOUT SYSTEM 
The final readout system can be seen in Figure 9. As 
previously stated, a Wheatstone bridge is typically 
used for strain gauge pressure measurements and 
this case is no exception. Nevertheless, additional 
components are required, so as to amplify the 
resultant signal, which is of very low amplitude. The 
signal  is  also  filtered  in  order  to  reduce  the high  
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