
 
chromium merely serves to act as a bond between 
the silicon and the gold. Next, a layer of photoresist 
is applied to the gold surface of the wafer by spin 
coating such that the resultant thickness is at least 
twice that of the desired magnetoelastic film to be 
deposited later. This photoresist is then UV exposed 
using a positive mask comprised of evenly-spaced 
rectangles, which are the desired length and width of 
the magnetoelastic sentinels. The wafer is then 
developed in a 2:1 solution of de-ionized water and 
AZ-400K developer, rinsed, dried, and then 
inspected for pattern integrity and thickness. 
The magnetoelastic film is then deposited onto 
the patterned wafer using the same sputtering system 
as before. First, the wafer is loaded into the 
deposition chamber, along with a gold, iron, and 
boron target for each of the three cathodes, and then 
the chamber is pumped down to 7×10
-7
 Torr in order 
to minimize residual oxygen in the film. Next, a gold 
layer is deposited onto the patterned wafer to a 
thickness of about 30–40 nm. The magnetoelastic 
layer is formed by co-depositing iron (DC) and 
boron (RF) simultaneously using a dual-cathode 
method. This method differs somewhat from the 
usual procedure for co-sputtering iron and boron, 
which typically involves using a specially made 
composite target. The advantage here is that the 
power of each cathode can be tuned separately such 
that the film has the desired composition at a 
reasonable deposition rate. Thickness of this film 
depends on process conditions, and is generally 
limited by the thickness of the photoresist layer, but 
highly magnetostrictive films of up to about 7 µm 
have been obtained using this dual-cathode method. 
Finally, another gold layer, using the same 
processing conditions as before, is applied on top of 
the iron-boron film, such that the magnetostrictive 
particles will be completely enclosed in gold. From 
an 8" wafer, approximately 40,000 sentinels can be 
fabricated. The cost of fabrication of a single 8" 
silicon wafer of sentinels is approximately $28.00. 
Hence the cost of a single ME sensor is less than 
1/1000 of a cent. 
2.3  Immobilization of the  
Bio-molecular Recognition Layer 
To form functional sentinels, a bio-molecular 
recognition element must be immobilized onto a 
transducing platform to bind the specific target 
pathogenic species. Other investigators typically use 
traditional antibodies as the biorecognition element. 
The strengths and weaknesses of antibody binding 
are well known. An antibody  is  a  relatively  fragile 
 
Figure 6: The ME resonator fabrication process. 
species and subject to denaturation with 
consequential loss of sensitivity and other binding 
characteristics when exposed to unfavorable 
environments. Moreover, the quality of antibodies 
can vary with different animals and production 
variables. To be used in sentinels, antibodies require 
affinity purification and stabilization, which 
dramatically increases their cost. Monoclonal 
antibodies are more standard and selective, but their 
application in the field is hindered by their stability. 
The use of phage as substitute antibodies offers a 
stable, reproducible and inexpensive alternative 
(Petrenko, 2008, Petrenko and Smith, 2000). In 
contrast to antibodies, the phage structure is 
extraordinarily robust, being resistant to: heat (up to 
80 °C) (Brigati and Petrenko, 2005); organic 
solvents (e.g., acetonitrile) (Olofsson et al., 2001), 
urea (up to 6 M), acid, alkali and other chemicals. 
Purified phage can be stored indefinitely at moderate 
temperatures without losing infectivity and probe-
binding activity.  Three major factors contribute to 
the high affinity binding of landscape phage to their 
targets: a) constrained conformation of foreign 
peptides; b) their multivalent display—thousands of 
binding sites per phage filament; and c) extremely 
high local concentration of binding sites. The 
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