
 
effect transistor exhibits the higher current change as 
the same gate voltage applied (Yeo et al., 2000). In 
the previous works (Change et al., 2008a), it has 
already demonstrated IgG antibody sensing 
capability of SiGe nanowire sensor. First, the 3-
amino-propyltrime-thoxy-silane (APTS) was used to 
modify the surface, which can connect the bio-linker. 
APTS is used to modify the surface of native oxide 
layer around nanowires. Hydroxyl functional groups 
on the surface of native oxide layer were replaced by 
the methoxy groups of APTS molecules. After 
APTS modification, the surface of nanowire was 
terminated by amine groups. In the experimental 
environment, amine group is prone to be positively 
charged, that is, the surface potential nanowire 
increased, and the conductance of p-type nanowire 
decreased. Next, bis-sulfo-succinimidyl suberate 
(BS3) is used as linker between APTS and IgG 
antibody. BS3 treatment resulted in negative charges. 
Hence, the conductance of p-type nanowires 
increased. After APTS and BS3 modification, 
nanowire was capable of capturing IgG antibody. 
Instead of the convention silicon nanowire, SiGe 
nanowire sensor is expected to have better 
sensitivity in the chemical detection for higher 
carrier mobility as the same bio-molecular bind on 
the surface. It is well known that annealing 
temperature did repair the interior defects of SiGe. 
The higher concentration of Ge the higher sensitivity 
would become. However, excess of Ge will induce 
more vacancies of surface, which will degrade the 
adhesion between APTS and interface and decrease 
sensitivity (Change et al., 2008b). 
In this paper, we used the sidewall spacer 
technique to fabricate the Si
0.93
Ge
0.07
 and Si
0.86
Ge
0.14
 
nanowires with different annealing temperature for 
discussion of the sensitivity, respectively. We focus 
on investigating the change of conductance (ΔG) and 
sensitivity (S) of different samples corresponding to 
APTS treatment. 
2 EXPERIMENT 
The structure is shown in Figure 1. All test samples 
were fabricated on p-type (100)-oriented bare silicon 
wafer with 1~10 Ω-cm resistivity. The poly-Si, 
Si
0.93
Ge
0.07
 and Si
0.86
Ge
0.14
 nanowires were 
fabricated by the side-wall spacer technique using 
the combination of the conventional lithography and 
processes technology, respectively. Starting with 
standard RCA clean of silicon substrate, wet 
oxidation was performed by SVCS Furnace system 
at 980℃ for 7 hours to grow the bottom oxide of 
about 5500 Å as an insulator oxide. After 
lithography patterning of active area, oxide was 
etched by Tokyo Electron Limited TE5000 Reactive 
Ion Etch (RIE) system to form a 3000 Å oxide step. 
Then, standard RCA clean was performed, followed 
by a amorphous silicon (α-Si) film of 200 Å 
deposition by SVCS Furnace system at 650℃ as 
seed layer for SiGe film deposition. Then, a 
polycrystalline SiGe film of 600 Å was deposited by 
the ultra-high-vacuum chemical vapor deposition 
(ANELAVA SiGe UHV-CVD) at 665℃. After 
lithography patterning of the Source/Drain (S/D) 
contact region, the SiGe film (800 Å, 20% over 
etched) was etched by Transformer Coupled Plasma 
(TCP) poly etcher. Only the S/D contact region and 
the side-wall spacer retained SiGe. The residue SiGe 
film is called SiGe nanowire. After lithography 
patterning of removal of unwanted sidewall spacer, 
the SiGe nanowire were etched and isolated. Finally, 
Boron was heavily doped with 5×10
15 
atoms/cm
2
 at 
10 keV to form p-type SiGe nanowire. Next, the 
samples were subject to activation annealing in 
nitrogen (N
2
) ambient at 800, 900, 950 and 1000 ℃ 
for 30 minutes. The aluminum was deposited by 
thermal coater and patterned to reserve the S/D 
region and sintered at 400
o
C for 30 minutes. 
The Hewlett Packard HP 4156A was used in this 
study to measure the electric characteristics of 
nanowire sensor. Drain voltage (V
D
) was varied 
from -10 to 10V and 500 mV a step, and back gate 
voltage was 0 V. The measurement of electric 
characteristics was performed ate every stage of 
surface modification, and the average conductance 
was then extracted from I
D
-V
D
 characteristics with 
V
D
 = 3~6 V. 
 
Figure 1: Schematic representation of SiGe nanowire 
structure by the side-wall spacer technique. 
3  RESULTS AND DISCUSSIONS 
The  sensitivity  (S)  of  a  nanowire-based  sensor  is 
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