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Authors: Yoshiharu Nakamura 1 and Shuichi Enokida 2

Affiliations: 1 Kyushu Institute of Technology, Mitsui High Tech and Inc., Japan ; 2 Kyushu Institute of Technology, Japan

ISBN: 978-989-758-175-5

Keyword(s): Machine Vision, Defect Detection, Multiple Light Source Imaging, IC Lead Frame.

Related Ontology Subjects/Areas/Topics: Computer Vision, Visualization and Computer Graphics ; Features Extraction ; Image and Video Analysis ; Image Formation and Preprocessing ; Image Generation Pipeline: Algorithms and Techniques

Abstract: It is especially needed for the IC lead frames used in the manufacture of semiconductors, which require both high quality and miniaturization. To overcome above, automatic defect detection systems based on image processing methods were proposed. Especially, this paper focuses on methods using the surface normal direction to detect a deformation in flat parts. Since most of these methods use a fixed parameter, the risk of missing a defect in industrial parts becomes a problem. In this paper, new defect detection method is proposed for detecting various defect sizes and defect types. This method determines the appropriate block size based on the median value of luminance dispersions calculated for several block sizes and learning from a sample that detects a defect point beforehand. We used 105 samples in our experiments. Our experimental results show our proposed method selects the superior parameters and identification of the defect area selected is superior with learning in detecting defects of several sizes. (More)

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Paper citation in several formats:
Nakamura, Y. and Enokida, S. (2016). Development of Defect Verification System of IC Lead Frame Surface using a Ring-lighting.In Proceedings of the 11th Joint Conference on Computer Vision, Imaging and Computer Graphics Theory and Applications - Volume 4 VISAPP: VISAPP, (VISIGRAPP 2016) ISBN 978-989-758-175-5, pages 117-125. DOI: 10.5220/0005675801170125

@conference{visapp16,
author={Yoshiharu Nakamura. and Shuichi Enokida.},
title={Development of Defect Verification System of IC Lead Frame Surface using a Ring-lighting},
booktitle={Proceedings of the 11th Joint Conference on Computer Vision, Imaging and Computer Graphics Theory and Applications - Volume 4 VISAPP: VISAPP, (VISIGRAPP 2016)},
year={2016},
pages={117-125},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0005675801170125},
isbn={978-989-758-175-5},
}

TY - CONF

JO - Proceedings of the 11th Joint Conference on Computer Vision, Imaging and Computer Graphics Theory and Applications - Volume 4 VISAPP: VISAPP, (VISIGRAPP 2016)
TI - Development of Defect Verification System of IC Lead Frame Surface using a Ring-lighting
SN - 978-989-758-175-5
AU - Nakamura, Y.
AU - Enokida, S.
PY - 2016
SP - 117
EP - 125
DO - 10.5220/0005675801170125

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