Authors:
Mariia Kepper
1
;
Pol Ribes-Pleguezuelo
2
;
Marcel Hornaff
2
;
Erik Beckert
2
;
Ramona Eberhardt
2
;
Pascal Pranyies
3
;
Isabelle Toubhans
3
;
Francis Descours
3
and
Andreas Tünnermann
2
Affiliations:
1
Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Albert-Einstein-Str. 7, 07745 Jena, Germany, Friedrich Schiller University Jena, Abbe School of Photonics, Albert-Einstein-Straße 6, 07745 Jena and Germany
;
2
Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Albert-Einstein-Str. 7, 07745 Jena and Germany
;
3
Sodern, 20 Avenue Descartes, 94451 Limeil-Brevannes and France
Keyword(s):
Optical Filter, Solderjet Bumping Technique, Space, Satellite, Earth Observation.
Related
Ontology
Subjects/Areas/Topics:
Optics
;
Optics in Astronomy and Astrophysics
;
Photodetectors, Sensors and Imaging
;
Photonic and Optoelectronic Materials and Devices
;
Photonics
;
Photonics, Optics and Laser Technology
;
Spectroscopy, Imaging and Metrology
Abstract:
The goal of our study is to optimize the packaging process of an optical sensor module under the space mission requirements. The intention of the project is to develop a generation of optical sensor modules avoiding conventional organic adhesives (standard used technologies). The sensor module, designed by Sodern, consists of three parts: the sensor, the filter frame and the filter. The Solderjet Bumping is planned to be used for assembling KOVAR(29 % Ni, 17 % Co, 54 % Fe) and N-BK10 (Borosilicate-Kronglas, Schott glass) and for assembling KOVAR and KOVAR materials, chosen for this application, and creation of a strong bond between these materials, which should withstand the harsh environmental space conditions.