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Authors: Seungoh Han 1 ; Chang-Hyeon Ji 2 ; Jae-Hyoung Park 3 and Jong-Uk Bu 4

Affiliations: 1 Hoseo University, Korea, Republic of ; 2 Ewha Womans University, Korea, Republic of ; 3 Dankook University, Korea, Republic of ; 4 Senplus Inc., Korea, Republic of

ISBN: 978-989-758-199-1

Keyword(s): Thermal Stability, Multi-physics, MEMS, Micro Scanner, Pico Projector.

Related Ontology Subjects/Areas/Topics: Application Domains ; Electronics Design and Manufacturing ; Robotics, Automation and Mechatronics ; Simulation and Modeling

Abstract: A practical application of multi-physics simulations was presented. In order to analyse thermal stability of MEMS micro scanner, multi-physics simulation procedure was proposed and then verified by comparing the simulated results to the measured data. The proposed procedure started from defining simulation parameters and was verified stepwise by comparing the interim results with the related experimental data, which has increased the accuracy of the proposed, multi-physics simulation procedure. Based on those results, we could got more insight into the thermal stability issue and the allowable bias limit could be determined, which does not deteriorate the device performance significantly. The proposed simulation procedure is expected to contribute for successful commercialization of MEMS micro scanner by increasing its thermal stability.

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Paper citation in several formats:
Han, S.; Ji, C.; Park, J. and Bu, J. (2016). Thermal Stability Simulation of MEMS Micro Scanner - Multi-physics Simulations Coupled with Experimental Verifications.In Proceedings of the 6th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH, ISBN 978-989-758-199-1, pages 84-88. DOI: 10.5220/0005962700840088

@conference{simultech16,
author={Seungoh Han. and Chang{-}Hyeon Ji. and Jae{-}Hyoung Park. and Jong{-}Uk Bu.},
title={Thermal Stability Simulation of MEMS Micro Scanner - Multi-physics Simulations Coupled with Experimental Verifications},
booktitle={Proceedings of the 6th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH,},
year={2016},
pages={84-88},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0005962700840088},
isbn={978-989-758-199-1},
}

TY - CONF

JO - Proceedings of the 6th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH,
TI - Thermal Stability Simulation of MEMS Micro Scanner - Multi-physics Simulations Coupled with Experimental Verifications
SN - 978-989-758-199-1
AU - Han, S.
AU - Ji, C.
AU - Park, J.
AU - Bu, J.
PY - 2016
SP - 84
EP - 88
DO - 10.5220/0005962700840088

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