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Authors: Beibei Ma ; Seán McLoone and John Ringwood

Affiliation: National University of Ireland Maynooth, Ireland

ISBN: 978-972-8865-84-9

Keyword(s): Semiconductor manufacturing, plasma etching, metal etching, optical emission spectroscopy (OES), principal component analysis (PCA), batch processing.

Related Ontology Subjects/Areas/Topics: Business Analytics ; Change Detection ; Computer Vision, Visualization and Computer Graphics ; Data Engineering ; Feature Extraction ; Features Extraction ; Image and Video Analysis ; Informatics in Control, Automation and Robotics ; Signal Processing, Sensors, Systems Modeling and Control

Abstract: This paper explores the application of principal component analysis (PCA) to the monitoring of within-lot and between-lot plasma variations that occur in a plasma etching chamber used in semiconductor manufacturing, as observed through Optical Emission Spectroscopy (OES) analysis of the chamber exhaust. Using PCA, patterns that are difficult to identify in the 2048-dimension OES data are condensed into a small number of principle components (PCs). It is shown, with the aid of experimental data, that by simply tracking changes in the directions of these PCs both inter-lot and intra-lot patterns can be identified.

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Paper citation in several formats:
Ma B.; McLoone S.; Ringwood J. and (2007). TRACKING PLASMA ETCH PROCESS VARIATIONS USING PRINCIPAL COMPONENT ANALYSIS OF OES DATA.In Proceedings of the Fourth International Conference on Informatics in Control, Automation and Robotics - Volume 3: ICINCO, ISBN 978-972-8865-84-9, pages 361-364. DOI: 10.5220/0001629303610364

@conference{icinco07,
author={Beibei Ma and Seán McLoone and John Ringwood},
title={TRACKING PLASMA ETCH PROCESS VARIATIONS USING PRINCIPAL COMPONENT ANALYSIS OF OES DATA},
booktitle={Proceedings of the Fourth International Conference on Informatics in Control, Automation and Robotics - Volume 3: ICINCO,},
year={2007},
pages={361-364},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0001629303610364},
isbn={978-972-8865-84-9},
}

TY - CONF

JO - Proceedings of the Fourth International Conference on Informatics in Control, Automation and Robotics - Volume 3: ICINCO,
TI - TRACKING PLASMA ETCH PROCESS VARIATIONS USING PRINCIPAL COMPONENT ANALYSIS OF OES DATA
SN - 978-972-8865-84-9
AU - Ma, B.
AU - McLoone, S.
AU - Ringwood, J.
PY - 2007
SP - 361
EP - 364
DO - 10.5220/0001629303610364

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