Authors:
Pol Ribes-Pleguezuelo
1
;
Katherine Frei
2
;
Gudrun Bruckner
3
;
Erik Beckert
2
;
Ramona Eberhardt
2
and
Andreas Tünnermann
1
Affiliations:
1
Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Institute of Applied Physics IAP and Friedrich-Schiller University Jena, Germany
;
2
Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Germany
;
3
Carinthian Tech Research AG, Austria
Keyword(s):
Surface Acoustic Wave Sensor, Optical Crystal, Packaging, Solderjet Bumping Technique, Lithiumniobate.
Related
Ontology
Subjects/Areas/Topics:
Photodetectors, Sensors and Imaging
;
Photonic and Optoelectronic Materials and Devices
;
Photonics
;
Photonics, Optics and Laser Technology
;
Ultrafast Electronics, Photonics and Optoelectronics
Abstract:
Solderjet bumping technique was applied to assemble a Surface Acoustic Wave (SAW) sensor prototype designed with a lithiumniobate crystal and a base sub-mount made of stainless steel. The assembly was designed with this technology in order to withstand the device’s mechanical strength requirements. The initial performed tests showed that the solderjet bumping technique can be used to assemble brittle components without creating internal damage in the crystal. The selected solder alloy Au80Sn20 used to fasten the lithiumniobate showed proper alloy wettability and joint strength on the crystal and on the substrate material. Finally, a lithiumniobate die device was soldered by soldering means to the stainless steel sub-mount, and withstood the strength device requirements by passing robustness (push) tests.