Authors:
Shigeyuki Takagi
1
;
Hirotaka Tanimura
1
;
Tsutomu Kakuno
2
;
Rei Hashimoto
2
;
Kei Kaneko
2
and
Shinji Saito
2
Affiliations:
1
Department of Electrical and Electronics Engineering, School of Engineering, Tokyo University of Technology, 1404-1 Katakura, Hachioji, Tokyo, Japan
;
2
Corporate Manufacturing Engineering Center, Toshiba Corporation, 8 Shinisogo, Isogo, Yokohama, Kanagawa, Japan
Keyword(s):
Quantum Cascade Lasers, QCLs, Surface-emitting QCL, Photonic Crystal, PhC, Static Method, Structure Function, Thermal Resistance, Thermal Flow Analysis, Diamond Submount.
Abstract:
We have evaluated the thermal resistance of the surface-emitting QCL, which is expected to increase the output and improve the beam quality, based on the structure function and 3D heat flow resolution. From the structure function, the thermal resistance of the surface emitting QCL was divided into the mesa for laser excitation, the InP substrate, and the CuW mount, and the total thermal resistance of 8.0 K/W was obtained. The thermal resistance obtained by the 3D thermal analysis simulation was estimated to be 8.3 K/W, which was in good agreement with that obtained from the structure function. Furthermore, the effect of the diamond submount was evaluated and it was shown that the thermal resistance was reduced to 5.2 K/W. It is considered that the thermal resistance is reduced by the horizontal transfer of heat in the diamond submount.