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Authors: Eren Unlu ; Christophe Moy ; Yves Louet and Jacques Palicot

Affiliation: CentraleSupelec-IETR, France

ISBN: 978-989-758-200-4

Keyword(s): Capacity analysis, Manycore processor chip, OFDMA.

Abstract: We study here the case of a 2048 cores chip, where cores are spread into 32 tilesets of 16 tiles containing 4 cores each. Each of the 32 tilesets has a RF access point to the serpentine transmission line across the chip. Inside tilesets, a 2-D mesh is used between the 16 tiles where a crossbar switch joints 4 cores, one RAM block and one DMA unit. Total 1 Terabytes memory is physically distributed into all tiles but logically shared between all cores and managed by a distributed hybrid cache coherency protocol (DHCCP). From the RFNoC point of view, a 20 GHz bandwidth between 20 and 40 GHz is shared into 1024 carriers between all 32 RF access nodes. The novelty of our work is that we have derived, in previous publications, algorithms able to dynamically share the RF resources between the 32 nodes. It has been stated by simulations that the channel transfer function is flat in the 20-40 GHz frequency band and just depends on the distance between nodes. The scope of this paper is to make a capacity analysis on the different links between nodes and to derive mean capacity evaluation of the RF NoC. We state that only -42 dBm of transmission power on the RF line is necessary to reach a 6 bits/s/Hz spectral efficiency. (More)

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Paper citation in several formats:
Unlu E.; Moy C.; Louet Y.; Palicot J. and (2016). Capacity Analysis of Radio Frequency Interconnect for Manycore Processor Chips.In Proceedings of the Fifth International Conference on Telecommunications and Remote Sensing - Volume 1: ICTRS, ISBN 978-989-758-200-4, pages 71-77. DOI: 10.5220/0006227300710077

@conference{ictrs16,
author={Eren Unlu and Christophe Moy and Yves Louet and Jacques Palicot},
title={Capacity Analysis of Radio Frequency Interconnect for Manycore Processor Chips},
booktitle={Proceedings of the Fifth International Conference on Telecommunications and Remote Sensing - Volume 1: ICTRS,},
year={2016},
pages={71-77},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0006227300710077},
isbn={978-989-758-200-4},
}

TY - CONF

JO - Proceedings of the Fifth International Conference on Telecommunications and Remote Sensing - Volume 1: ICTRS,
TI - Capacity Analysis of Radio Frequency Interconnect for Manycore Processor Chips
SN - 978-989-758-200-4
AU - Unlu, E.
AU - Moy, C.
AU - Louet, Y.
AU - Palicot, J.
PY - 2016
SP - 71
EP - 77
DO - 10.5220/0006227300710077

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