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Authors: Mika Ohstuki and Tetsuro Kakeshita

Affiliation: Computing Division, Saga University, Honjo-machi 1, Saga City 840-8502, Japan

Keyword(s): Educational Support Systems, Software Engineering, Software Process, Design Pattern, Source Code.

Abstract: Software engineers need to learn a variety of knowledge and skills to develop various artifacts, such as software specification, software design, source code, and test code, during the software process. We are developing a visualization tool named VRale-SCM for various artifacts and the relationship among them in VR space. A software engineer can freely navigate the artifacts to deeply understand the artifacts and the relationship among them. In this paper, we propose a mechanism to generate a relationship between the design pattern and Java source code. Integration of the proposed mechanism to VRale-SCM will enrich the educational contents of the system so that the educational effect will be further improved.

CC BY-NC-ND 4.0

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Paper citation in several formats:
Ohstuki, M. and Kakeshita, T. (2021). Generating Relationship between Design Pattern and Source Code. In Proceedings of the 13th International Conference on Computer Supported Education - Volume 2: CSEDU; ISBN 978-989-758-502-9; ISSN 2184-5026, SciTePress, pages 288-293. DOI: 10.5220/0010472502880293

@conference{csedu21,
author={Mika Ohstuki. and Tetsuro Kakeshita.},
title={Generating Relationship between Design Pattern and Source Code},
booktitle={Proceedings of the 13th International Conference on Computer Supported Education - Volume 2: CSEDU},
year={2021},
pages={288-293},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0010472502880293},
isbn={978-989-758-502-9},
issn={2184-5026},
}

TY - CONF

JO - Proceedings of the 13th International Conference on Computer Supported Education - Volume 2: CSEDU
TI - Generating Relationship between Design Pattern and Source Code
SN - 978-989-758-502-9
IS - 2184-5026
AU - Ohstuki, M.
AU - Kakeshita, T.
PY - 2021
SP - 288
EP - 293
DO - 10.5220/0010472502880293
PB - SciTePress