Study on Optimization of Fatigue Test of Nanosilver Solder

Hui Yang; Yang Zhang; Ji hui Wu

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Paper

Study on Optimization of Fatigue Test of Nanosilver Solder

In Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials ICIMM - Volume 1, 112-115, 2018 , Guangzhou, China

Authors: Hui Yang ; Yang Zhang and Ji hui Wu

Affiliation: School of mechanical and control engineering and Guilin University of Technology, China

Keyword(s): Nano silver paste, sintering, mechanical fatigue test, cycle life.

Abstract: Nanosilver solder paste due to its high melting point, low sintering temperature and good electrical/thermal conductivity and mechanical reliabilitySex, more and more attention by the electronic packaging industry. And, as a new type of lead-free thermal interfaceMaterials, nano-silver solder paste has the potential to gradually replace traditional solder and conductive silver paste, used in high-temperature power electronicsIn thedevice packaging, according to the isothermal mechanicalfatigue test,a temperature-dependent fatigue life prediction model is proposed, and the cycle life of the nanosilver solder paste lap joint at different temperatures is accurately predicted.

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Paper citation in several formats:

Yang, H.; Zhang, Y. and Wu, J. (2019). Study on Optimization of Fatigue Test of Nanosilver Solder. In Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - ICIMM; ISBN 978-989-758-345-2, SciTePress, pages 112-115. DOI: 10.5220/0007527301120115

@conference{icimm19,
author={Hui Yang. and Yang Zhang. and Ji hui Wu.},
title={Study on Optimization of Fatigue Test of Nanosilver Solder},
booktitle={Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - ICIMM},
year={2019},
pages={112-115},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0007527301120115},
isbn={978-989-758-345-2},
}

TY - CONF

JO - Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - ICIMM
TI - Study on Optimization of Fatigue Test of Nanosilver Solder
SN - 978-989-758-345-2
AU - Yang, H.
AU - Zhang, Y.
AU - Wu, J.
PY - 2019
SP - 112
EP - 115
DO - 10.5220/0007527301120115
PB - SciTePress