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Authors: Jing Pan ; Li-chun Bian and Ming Gao

Affiliation: Key Laboratory of Mechanical Reliability for Heavy Equipments and Large Structures of Hebei Province Yanshan University, Qinhuangdao 066004 and PR China, China

Keyword(s): Particle, agglomeration, interphase, Composite.

Abstract: In this paper, a simple approach is described to investigate the effects of particle content, presence of interphase and agglomeration on the effective modulus of nanocomposites. A new micromechanical agglomeration model and the Mori-Tanaka method are applied to account for these effects. In the process of derivation, the composite is divided into two parts and the particles encapsulated by an interphaseare regarded as a system. The main effects of nanoparticle radius and interphase thickness, as well as interphase properties, on elastic modulus of nanocomposites are also discussed. The findings show that the nanoparticle agglomeration significantly reduces the effective elastic modulus of composites.

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Paper citation in several formats:
Pan, J.; Bian, L. and Gao, M. (2019). Effects of Particle Agglomeration and Interphase on Nonacomposites. In Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - ICIMM; ISBN 978-989-758-345-2, SciTePress, pages 251-255. DOI: 10.5220/0007530002510255

@conference{icimm19,
author={Jing Pan. and Li{-}chun Bian. and Ming Gao.},
title={Effects of Particle Agglomeration and Interphase on Nonacomposites},
booktitle={Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - ICIMM},
year={2019},
pages={251-255},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0007530002510255},
isbn={978-989-758-345-2},
}

TY - CONF

JO - Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - ICIMM
TI - Effects of Particle Agglomeration and Interphase on Nonacomposites
SN - 978-989-758-345-2
AU - Pan, J.
AU - Bian, L.
AU - Gao, M.
PY - 2019
SP - 251
EP - 255
DO - 10.5220/0007530002510255
PB - SciTePress

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