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Authors: Songpin Ran ; Takaaki Kakitsuka and Kiyoto Takahata

Affiliation: Graduate School of Information, Production and Systems, Waseda University, Kitakyushu, Fukuoka 808-0135, Japan

Keyword(s): Chip-to-Chip Interconnection, Optical Waveguide, BPM.

Abstract: For chip-to-chip interconnection, a Pbit/s-class transmission capacity is expected to be developed in near future. To achieve such a huge capacity, a multilayer optical waveguide structure for connection between chips is indispensable. In this paper, a square base cuboid-core structure with size modulation for vertical light beam propagation in a polymer multilayer waveguide is proposed for improving optical coupling between the optical devices and waveguide. A 10-layer polymer waveguide with nonuniform cuboid cores are designed for single-mode transmission at 1.31 μm. Using a simulation based on the beam propagation method, it is confirmed that the proposed design can provide a coupling efficiency of −4.4 dB, which is 3.8 dB higher than that of a previously reported uniform cube-core design, for the 10-layer structure and a crosstalk of −20.6 dB. The simulated results show that the proposed nonuniform cuboid-core structure has the potential to realize a 10-layer optical waveguide st ructure for future chip-to-chip optical interconnection with a huge transmission capacity. (More)

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Paper citation in several formats:
Ran, S.; Kakitsuka, T. and Takahata, K. (2020). Vertical Optical Waveguide Comprising Square Base Cuboid Cores with Size Modulation for Multilayer Chip-to-Chip Interconnection. In Proceedings of the 8th International Conference on Photonics, Optics and Laser Technology - PHOTOPTICS; ISBN 978-989-758-401-5; ISSN 2184-4364, SciTePress, pages 174-179. DOI: 10.5220/0009173401740179

@conference{photoptics20,
author={Songpin Ran. and Takaaki Kakitsuka. and Kiyoto Takahata.},
title={Vertical Optical Waveguide Comprising Square Base Cuboid Cores with Size Modulation for Multilayer Chip-to-Chip Interconnection},
booktitle={Proceedings of the 8th International Conference on Photonics, Optics and Laser Technology - PHOTOPTICS},
year={2020},
pages={174-179},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0009173401740179},
isbn={978-989-758-401-5},
issn={2184-4364},
}

TY - CONF

JO - Proceedings of the 8th International Conference on Photonics, Optics and Laser Technology - PHOTOPTICS
TI - Vertical Optical Waveguide Comprising Square Base Cuboid Cores with Size Modulation for Multilayer Chip-to-Chip Interconnection
SN - 978-989-758-401-5
IS - 2184-4364
AU - Ran, S.
AU - Kakitsuka, T.
AU - Takahata, K.
PY - 2020
SP - 174
EP - 179
DO - 10.5220/0009173401740179
PB - SciTePress

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