Thermal Optimization Design of PBGA Package Based on Finite Element Analysis

Hui Yang, Jihui Wu, Yang Zhang

2018

Abstract

In order to solve the problem of chip heat dissipation in PBGA package, this paper takes PBGA as the research Object to study the reliability of electronic packaging. Since the BGA package form is the main packaging technology at present, the problem of thermal failure has been particularly prominent in BGA, which also became the hot issues^([1]). Now a method is proposed to establish a finite element approximation model of the package structure, perform thermal stress analysis, and reconstruct the original optimization problem. Identify the influencing factors of thermal failure, and based on these problems, through the establishment of mathematical model analysis, optimize the structure. And for problems that can not be fully solved by the stablilization, the key points of future research directions are proposed and the next step of research work is guided.

Paper Citation

in Harvard Style

Yang H., Wu J. and Zhang Y. (2018). Thermal Optimization Design of PBGA Package Based on Finite Element Analysis.In Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - Volume 1: ICIMM, ISBN 978-989-758-345-2, pages 103-106. DOI: 10.5220/0007527101030106

in Bibtex Style

@conference{icimm18,
author={Hui Yang and Jihui Wu and Yang Zhang},
title={Thermal Optimization Design of PBGA Package Based on Finite Element Analysis},
booktitle={Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - Volume 1: ICIMM,},
year={2018},
pages={103-106},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0007527101030106},
isbn={978-989-758-345-2},
}

in EndNote Style

TY - CONF

JO - Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - Volume 1: ICIMM,
TI - Thermal Optimization Design of PBGA Package Based on Finite Element Analysis
SN - 978-989-758-345-2
AU - Yang H.
AU - Wu J.
AU - Zhang Y.
PY - 2018
SP - 103
EP - 106
DO - 10.5220/0007527101030106