Lithiumniobate Die Assembled by a Low-stress Soldering Technique - Method to Fasten a Surface Acoustic Wave Sensor

Pol Ribes-Pleguezuelo, Katherine Frei, Gudrun Bruckner, Erik Beckert, Ramona Eberhardt, Andreas Tünnermann

Abstract

Solderjet bumping technique was applied to assemble a Surface Acoustic Wave (SAW) sensor prototype designed with a lithiumniobate crystal and a base sub-mount made of stainless steel. The assembly was designed with this technology in order to withstand the device’s mechanical strength requirements. The initial performed tests showed that the solderjet bumping technique can be used to assemble brittle components without creating internal damage in the crystal. The selected solder alloy Au80Sn20 used to fasten the lithiumniobate showed proper alloy wettability and joint strength on the crystal and on the substrate material. Finally, a lithiumniobate die device was soldered by soldering means to the stainless steel sub-mount, and withstood the strength device requirements by passing robustness (push) tests.

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Paper Citation


in Harvard Style

Ribes-Pleguezuelo P., Frei K., Bruckner G., Beckert E., Eberhardt R. and Tünnermann A. (2018). Lithiumniobate Die Assembled by a Low-stress Soldering Technique - Method to Fasten a Surface Acoustic Wave Sensor.In Proceedings of the 6th International Conference on Photonics, Optics and Laser Technology - Volume 1: PHOTOPTICS, ISBN 978-989-758-286-8, pages 91-97. DOI: 10.5220/0006645400910097


in Bibtex Style

@conference{photoptics18,
author={Pol Ribes-Pleguezuelo and Katherine Frei and Gudrun Bruckner and Erik Beckert and Ramona Eberhardt and Andreas Tünnermann},
title={Lithiumniobate Die Assembled by a Low-stress Soldering Technique - Method to Fasten a Surface Acoustic Wave Sensor},
booktitle={Proceedings of the 6th International Conference on Photonics, Optics and Laser Technology - Volume 1: PHOTOPTICS,},
year={2018},
pages={91-97},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0006645400910097},
isbn={978-989-758-286-8},
}


in EndNote Style

TY - CONF

JO - Proceedings of the 6th International Conference on Photonics, Optics and Laser Technology - Volume 1: PHOTOPTICS,
TI - Lithiumniobate Die Assembled by a Low-stress Soldering Technique - Method to Fasten a Surface Acoustic Wave Sensor
SN - 978-989-758-286-8
AU - Ribes-Pleguezuelo P.
AU - Frei K.
AU - Bruckner G.
AU - Beckert E.
AU - Eberhardt R.
AU - Tünnermann A.
PY - 2018
SP - 91
EP - 97
DO - 10.5220/0006645400910097